This product is suitable for safety performance testing, reliability testing, product screening testing, etc. of electronic components and materials, which can shorten the development cycle and improve the reliability and quality control level of products. It is an indispensable and powerful partner for related enterprises, research institutions, etc. Widely used in thermal shock testing in industries such as aerospace, automotive, electrical and electronic, semiconductor, battery, new energy, solar photovoltaic modules, etc.
Used to test and determine the parameters and performance of electrical, electronic, and other products and materials after temperature environmental impact changes during high and low temperature testing.
Short temperature recovery time
Multiple industry standards require the control of surface recovery time for speciment, and the standard STT sensor can be linked with the controller to easily and perfectly reproduce standard conditions.
The standard temperature recovery time of the speciment can reach within 15 minutes.
Improved temperautre uniformity
Uniform airflow in the test area allows outstanding temperature uniformity. Uniform thermal stress is applied to each speciment,minimizing variation in test results.
Smooth specimen transfer
"Soft move mode" is automatically activated when specimens move between the hot and cold chambers to reduce vibration and shock.
Test area anti-drop mechanism to protect specimens
The test area's drive unit is equipped with a braking device to prevent specimens from falling the test area under any abnormal situations.
Comprehensive safety system
A double safety system ensures that any transfer between test areas stops automatically when the door is open,and that the door locks while transfer isin progress.
Specimen Temperature Trigger (STT)
With up to two sensors attached tospecimen(s), the STT function begins counting the exposure time once thenspecimen reaches a set temperature, or promptly activates moving of the specimen for the next exposure. This reduces overall testing time and ensures accurate specimen temperatures Temperature readings can be recorded for each specimen and test area by connecting a temperature recorder.
Cable ports on right sides (100mm) as standard to allow easy wiring access.
Safe specimen handling thanks to ambient temperature recovery
The ambient temperature recovery feature intakes external air to return the test area to an ambient temperature after testing has finished or been paused.
Viewing window (including light) as standard
Can check the status of speciment at any time during the test.
Interface (option)for device communication can be selected between RS-485, GPIB, and RS-232C.
Color LCD touch screen controller, easy to operate
Temperature settings and measurements can be stored in the internal memory and exported with the use of USB flashdrives. This enables them to be displayed as graphs on web browsers and stored for back-up purposes.Test data can also be recorded in real time to a USB flash drive.
* USB flash drives not included
Programmed operation allows storing 40 program operation patterns, each up to 99 steps. temperature ramp settings and a maximum of 999 repeat cycles.
Can change the display lauguage from Japanese to Enlish,Simplified Chinese,Traditional Chiese at any time from the lanuage icon.
Remote monitor and control(Ethernet connection)
The chamber comes with an ESPEC original web application. Connecting to the chamber Ethernet port (LAN's port) makes it possible to control chamber monitoring, pattern setting, operation start/stop, and other operations from a computer web browser. Installation of special software is not required.
All you need is a standard computer web browser to connect with the chamber.
| Description | Model | Temp. Range | Transfer time between hot & cold chambers | Test area capacity | Inside dimensions(W×H×Dmm) | Outside dimensions(W×H×Dmm)※3 | Weight(Kg) |
| Thermal Shock Chamber | GTSD-100 |
Hot exposure range: +60℃ ~ +205℃ Cold exposure range: -77℃ ~ 0℃ |
Within 10 seconds | 100L | W710 x H345 x D410 | W1100 x H1885 x D196 | 1100 |
※1 Under the conditions of a +23℃ ambient temperature, cooling water temperature +25℃,rated voltage, and no specimen inside the test area.The performance values are based on lEC 60068-3-5:2001 & JIS C60068-3-5:2006、JTM K07:2007.The temperature Heat-up time and temperature Pull-down time are the performance of each chamber is operated independently.
※2 Two specimen baskets are set in the testing area from the top layer to the second layer, and from the bottom layer to the second layer. The surface temperature of the plastic mold IC (QFP208 pin) placed in the center of each 5kg specimen in the specimen baskets is measured.
※3 Measurements are to be taken in an anechoic room at a height of 1.2m from the floor, and a distance of im from the front panel (ISO 1996-1:2016 characteristics). According to different environmental settings and the influence of surrounding echoes, the noise level may increase, and attention should be paid to the installation environment of the equipment.
※4 The compressor is represented by HP, and kW represents the conversion value.
※5 A pressure regulator valve is required if the pressure exceeds 0.5MPa(5Kg/cm2G).
※6 When using a chiller for cooling water, if the cooling water temperature is lower than the ambient temperature, the pipes inside and outside the product may condense and drip water. If you believe that the cooling temperature provided to the device is low, please contact after-sales service.
※7 Rate depends on the cleanliness of the heat exchanger.